Senior Scientist (C2W bonding), (HI), IME

Job Description

Position Role

Process Integrator for Advanced Package Assembly for Heterogeneous Integration

The Advanced Packaging Program at the Institute of Microelectronics (IME) is seeking a passionate and skilled Scientist or Senior Scientist to join our team. This role is pivotal in advancing the state‑of‑the‑art chip‑to‑wafer/chip‑to‑chip fine‑pitch micro‑bump thermal compression bonding and chip‑to‑wafer fusion/hybrid bonding, underfilling and moulding capabilities, developing 2.5D interposer and 3D chip stacking assembly process integration flows for Heterogeneous Integration of chiplets. The position provides an exciting opportunity to contribute to groundbreaking technologies and collaborate with a dynamic team of researchers and external ecosystem stakeholders.

Key Responsibilities

• Lead flip chip bonding process capabilities development to scale down micro bump bonding and chip-to-wafer hybrid bonding technologies f...