Senior Product Engineer (Pkg PE MFG), Heterogeneous Integration Group(HIG), High Bandwidth Memo[...]
1100 Micron SemiAsiaOP Pte Ltd • singapore, singapore • Posted June 15, 2026
About the Role
Position Summary
As a member of HIG HBM Package Product Engineering, you will lead and develop a high‑performing team to drive Package and HBM Product engineering activities within the HBM Systems and Product Engineering Team. You will be part of a global team of professional Product Engineers leading a portfolio of best‑in‑class next‑generation HBM products focused on the critical KPIs: quality, cost, cycle time and scale.
Key Responsibilities
- ASM Yield and DPM Improvement: Accountable for improving assembly related coverage within the manufacturing flows to improve the Time 0 and Field DPM and reduce/prevent inline fallout within the assembly process.
- HBM Cube Yield Improvement: Improving HBM Cube yield through test optimization and coverages by collaboration with Technology Development and Packaging organizations to reduce Manufacturing Line Yield.
- Cumulative Yield Ownership: Work with cross‑functional teams, to lead impactful in...