Senior Advanced Packaging Architect for HPC/AI Chips

A leading technology company in Singapore is looking for a Staff/Principal Advanced Packaging Engineer. This hands-on leadership role involves driving advanced semiconductor packaging from concept through mass production. You will define the company's packaging roadmap, lead cross-functional co-design, and ensure reliable production for high-power devices. A Bachelor’s degree in Microelectronics and over 8 years of relevant experience are required. The role offers excellent professional growth opportunities and attractive benefits.
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