Senior 3DIC Engineer: TSV & Stacked-DIE Expert

Bitdeer, headquartered in Singapore, is seeking a skilled professional to define and drive the TSV and hybrid-bond interface. You will manage complex 3DIC designs and work closely with foundries and memory partners on advanced packaging solutions.

The role requires 5+ years of experience in the field, direct expertise with TSVs, and thermal analysis skills. The company values diversity and offers an exciting workplace with numerous growth and development opportunities.