Principal/Senior Engineer, APTD CEM - Advanced Packaging Integration Engineering
1100 Micron SemiAsiaOP Pte Ltd • singapore, singapore • Posted July 15, 2026
About the Role
Key Responsibilities
- Develop and enable advanced package technology for various post-fab wafer finish and assembly processes.
- Focus on improving product quality, driving yield improvements, reducing costs, and enhancing productivity.
- Integrate semiconductors while partnering with process and product engineering teams.
- Achieve and improve yields through silicon package integration innovation, including layout/design and process margin improvements.
- Collect and analyze data to provide actionable outcomes and decisions for layout, design, or integration flow changes.
- Work with Probe, Yield Analysis, Test, and Product Engineering teams to drive improvements.
- Ensure defense coverage through process, measurement, inspection, and testing.
- Establish correlations between defense mechanisms to identify improvement opportunities.
- Conduct continuous data analysis to establish advanced controls and identify impro...