ENGINEER, High Bandwidth Memory (HBM) & New Product Introduction (NPI)

We are looking for Engineers to become part of the Package Development Engineering Team for Advanced Packaging in Singapore. This individual contributor position supports next-generation memory and HBM packaging technologies, concentrating mainly on transitioning new product from development to high-volume manufacturing. The position partners closely with stakeholders such as Development Team & Manufacturing and supplier teams across Micron’s global network.

• Integrate AI‑assisted tools and insights into daily work to improve efficiency, quality or effectiveness.
• Contribute to a culture of continuous improvement by identifying, testing and sharing AI‑enablement enhancements within one scope of work.
• Apply engineering and statistical methods to accelerate learning cycles from Design of Experiments (DOE) through product qualifications.
• Partner with Advanced Package Technology Development (APTD) and manufacturing ...