Die Attach Process Engineer: Innovate & Validate Bonding Tech

Infineon Technologies in Malacca City is seeking a motivated candidate to conduct die attach process development. You will be responsible for optimizing parameters and validating processes while collaborating with teams to integrate these processes effectively.

The ideal candidate will have a Bachelor's degree in Engineering and preferably some experience in semiconductor manufacturing. Strong knowledge in relevant processes and tools will be advantageous. Fresh graduates are encouraged to apply.