APTM Advanced Packaging Dry Etch Development Manager
Intel • Hillsboro, OR • Posted June 03, 2026
About the Role
**Job Details:**
**Job Description:**
**The Role and Impact**
Intel Foundry is seeking an exceptional Advanced Packaging Dry Etch Module Development Manager to lead our plasma etch technology development for next-generation packaging solutions. This role will drive the development and implementation of dry etch processes critical to Intel's industry-leading advanced packaging portfolio, including Foveros Direct, Foveros, and EMIB (Embedded Multi-die Interconnect Bridge) technologies. The successful candidate will manage a team of process engineers while maintaining deep technical involvement in plasma physics and etch system optimization. This position offers the opportunity to influence Intel's roadmap for technology leadership, manufacturing excellence, and enabling next-generation computing solutions.
**Key Responsibilities**
- Lead and manage a team of engineers, providing clear goal setting, differentiated performance management, and co...
**Job Description:**
**The Role and Impact**
Intel Foundry is seeking an exceptional Advanced Packaging Dry Etch Module Development Manager to lead our plasma etch technology development for next-generation packaging solutions. This role will drive the development and implementation of dry etch processes critical to Intel's industry-leading advanced packaging portfolio, including Foveros Direct, Foveros, and EMIB (Embedded Multi-die Interconnect Bridge) technologies. The successful candidate will manage a team of process engineers while maintaining deep technical involvement in plasma physics and etch system optimization. This position offers the opportunity to influence Intel's roadmap for technology leadership, manufacturing excellence, and enabling next-generation computing solutions.
**Key Responsibilities**
- Lead and manage a team of engineers, providing clear goal setting, differentiated performance management, and co...